OPTELEX Optical and RF Engineering
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They want to reuse mechanics as much as possible, cooling systems, power splitters, power combiners, logics and also drivers and power supply units.
This means in the 95% of cases the outline dimensions of a new module shall be the same of the one they currently use in the field. Screws positions (those to fix the carrier and those to fix power devices) and I/O pads positions shall be the same too. This always have a big impact on the overall design.
Moreover in the recent past many customers often tried to imitate inexpertly demo boards or they reused the same PCB layout for different devices (NXP, Infineon, Toshiba, etc.). With the new generation of RF power components this “pseudo-interoperability" is no longer possible (bad performances).
Unlike devices made by generic manufacturers ALL OPTELEX designs are "focused" for each specific customer requirement (also for the field) and all rights, knowledge and intellectual properties will be always transferred to our clients, without extra costs. This is the key for your business success.
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